Essen, 26 June 2025 – LIDROTEC, a deep tech start-up pioneering next-generation laser systems for low-damage, high-precision chip cutting, has announced the successful closing of a $13.5 million Series A-2 financing round. The round was co-led by Lam Capital, the corporate venture arm of semiconductor fabrication equipment and services company Lam Research Corporation, and Goose Capital. New investors ZEISS Ventures and NRW.BANK joined the round and bring strong technical, operational and scale-up expertise. Existing investors including Goose Capital, Gründerfonds Ruhr and others contributed well above their pro rata.
LIDROTEC’s proprietary laser systems combine high-precision cutting with fluid-based cooling and cleaning, reducing material damage, heat affected zone width, and particle defects in grooving and dicing processes. This results in dramatically lower breakage rates and higher yields, particularly for difficult-to-dice hard materials and thin semiconductors.
This latest investment will enable LIDROTEC to accelerate product development and commercialization, grow its team, and deliver its novel liquid-mediated laser dicing solutions to both the compound semiconductor and leading-edge semiconductor markets.
“This funding is a major validation of our technology, team, and vision,” said Alexander Igelmann, Co-Founder and CEO of LIDROTEC. “The support from both leading financial and strategic partners gives us the firepower to scale globally and help address the pressing inefficiencies in chip production.”
“LIDROTEC’s novel approach to chip singulation has the potential to deliver significant yield improvements to companies in the power device, photonics, and semiconductor sectors. We’ve been impressed with the team and their technology since their strong showing at Lam Capital’s 2024 Venture Competition and are looking forward to seeing their capabilities commercialized,” said Kevin Chen, managing director of Lam Capital and corporate development at Lam Research.
“LIDROTEC has a proven track record of deep-tech innovation and is tackling highly relevant growth areas such as Advanced Packaging & High Bandwidth Memory,” said Thorsten Reuter, Head of Digital & Technology Ventures at NRW.BANK as well as Managing Director at Gründerfonds Ruhr. “We seek out technologies that are highly scalable and globally relevant, and LIDROTEC fits that profile perfectly. We are delighted to join this exceptional syndicate with NRW.BANK and to increase our commitment with Gründerfonds Ruhr.”
With the semiconductor sector increasing focus on throughput and yield, LIDROTEC’s solution comes at a crucial time for the industry.